发明名称 BONDING APPARATUS, METHOD OF MEASURING AMPLITUDE OF BONDING TOOL, AND METHOD OF CALIBRATING AMPLITUDE OF BONDING TOOL
摘要 <p>The disclosed bonding device is provided with an ultrasonic horn (12); a capillary (17); a flange (14), which causes minute vibrations along the length of the ultrasonic horn (12) by means of a load in the longitudinal direction applied to a joint on the ultrasonic horn (12) when the ultrasonic horn (12) is vibrating; a bonding arm (21), which is formed from metal in a single piece, and includes a front-end block (21a), a back-end block (21b), and a connection plate (24), and wherein the space between the front-end block (21a) and the back-end block (21b) fluctuates in the longitudinal direction of the ultrasonic horn (12) by means of the vibration of the ultrasonic horn (12); a load sensor (31), which detects the load in the longitudinal direction of the ultrasonic horn; and an amplitude measurement unit (50), which converts the load signal detected by the load sensor (31), and measures the amplitude of the capillary (17). As a result, the bonding device performs bonding sealer amplitude measurements with a simple method and high precision.</p>
申请公布号 SG183784(A1) 申请公布日期 2012.10.30
申请号 SG20120014247 申请日期 2010.03.23
申请人 SHINKAWA LTD. 发明人 AOYAGI, NOBUYUKI;MARUYA, YUSUKE
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