LIGHT EMITTING DEVICE MODULE

摘要

PURPOSE: A light emitting device module is provided to improve the reliability of a light emitting device package by forming a heat radiation pattern for radiating absorbed heat in a printed circuit board to the outside. CONSTITUTION: A light emitting device package(110) is mounted on a printed circuit board(120). The printed circuit board includes a copper foil layer(129) and an insulating layer(126) arranged on the copper foil layer. The copper foil layer supplies power to the light emitting device package. The copper foil layer includes a connector pattern(122) and a heat radiation pattern(124) electrically separated from an electrode pattern(123). The connector pattern is electrically connected to a connector connection unit through a connector.