A lamp formed from an array of tiltable LED packages mounted on a heat transfer plate

摘要

Disclosed is a light emitting diode (LED) array comprising an assembly of LED packages. The LED packages are mounted to a face of a substructure. The substructure includes a circuit board and a heat transfer plate. Each LED package has electrical connection terminals and a thermal connection pad. The electrical connection terminals are electrically connected to respective circuit conductors of the circuit board and the thermal pads are connected to the heat transfer plate by respective thermally conductive connections. At least one of the LED packages is tilted at an angle relative to an adjacent portion of the face of the substructure.