FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES

摘要

A microelectronic assembly 10 can include a substrate 30 having first and second surfaces 34, 58, an aperture 39 extending therebetween, and terminals 36. The assembly 10 can also include a first microelectronic element 12 having a front surface 16 facing the first surface 34, a second microelectronic element 14 having a front surface 22 projecting beyond an edge 29 of the first microelectronic element, first and second leads 70, 76 electrically connecting contacts 20, 52 of the microelectronic elements to the terminals, and third leads 73 electrically interconnecting the contacts of the first and second microelectronic elements. The contacts 20 of the first microelectronic element 12 can be disposed adjacent the edge 29. The contacts 26 of the second microelectronic element 14 can be disposed in a central region 19 of the front surface 22 thereof. The leads 70, 76, 99 can have portions aligned with the aperture 39.