发明名称 WIRING SUBSTRATE
摘要 <p>Wiring substrates (10, 40, 60, 80) have wiring patterns (13, 21, 41, 43, 65, 83a, 83b, 83c) and insulation layers (11, 26, 48, 81) to which the wiring patters are fixed. The insulation layers (11, 26, 48, 81) have end edges. The wiring patterns (13, 21, 41, 43, 65, 83a, 83b, 83c) comprise pattern bonding sections (14, 44, 66) that bond with the insulation layers (11, 26, 48, 81) and pattern extension sections (15, 45, 67, 85) that extend from the pattern bonding sections (14, 44, 66, 84) and jut out from the end edges of insulation layers (14, 44, 66). The insulation layers (11, 26, 48, 81) or the pattern bonding sections (14, 44, 66) have an outermost face. Connection terminals (T, T1) whereby part of the pattern extension sections (15, 45, 67, 85) can protrude from the outermost face of the insulation layers (11, 26, 48, 81) or the pattern bonding sections (14, 44, 66, 84) by bending the pattern extension sections (15, 45, 67, 85) are disposed on the wiring substrates.</p>
申请公布号 WO2012144238(A1) 申请公布日期 2012.10.26
申请号 WO2012JP50139 申请日期 2012.01.06
申请人 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI;SHIMADU, HITOSHI;SAWADA, TAKEHIKO;HAYAKAWA, TAKAHIRO;ASAI, TOMOAKI;YAMAUCHI, RYOU 发明人 SHIMADU, HITOSHI;SAWADA, TAKEHIKO;HAYAKAWA, TAKAHIRO;ASAI, TOMOAKI;YAMAUCHI, RYOU
分类号 H05K1/11;H05K1/02;H05K1/14 主分类号 H05K1/11
代理机构 代理人
主权项
地址