<p>A sampling device (10) for removing a surface portion from a substrate (112). The device includes a frame structure (16) and a cutter head assembly (12). The cutter head assembly (12) includes a pivot body (32) having a first end (42) supported at a pivot point (108) on the frame structure, and a cutter supported for rotation about a rotational axis at a second end (46) of the pivot body (32). The cutter has a semi - ellipsoidal shape (70) and a drive motor is operably connected to the cutter (70). The pivot point (108) is located in spaced relation to the rotational axis (AB). The cutter (70 is operable to cut a surface portion of a substrate (112) during pivotal movement about the pivot point (108).</p>
申请公布号
WO2012145137(A1)
申请公布日期
2012.10.26
申请号
WO2012US31128
申请日期
2012.03.29
申请人
SIEMENS ENERGY, INC.;VINDLER, MICHAEL, R.;LOVETT, RONALD, H.