发明名称 |
METHOD FOR PRODUCING SILICON CORE WIRE |
摘要 |
<p>In the present invention: a silicon core wire is cut out (S101) from a monocrystalline silicon or polycrystalline silicon cylindrical ingot; with the objective of eliminating residual warping arising during cutting processing, etching processing is performed (S102) by means of a mixed acid solution of hydrofluoric acid and nitric acid in a manner so that the amount removed is normally on the order of 50-200 µm; and the core wire is used (S103) in a precipitation reaction of polycrystalline silicon after etching. In the etching processing step, a thick oxide film is formed on the surface of the silicon core wire, and the film is a factor causing spark discharging. Thus, the present invention, a step (S104) is provided that eliminates the surface oxide film by cleaning the surface of the silicon core wire with a hydrofluoric acid solution following the step for eliminating processing warping of the surface by etching the silicon core wire using a mixed acid solution of hydrofluoric acid and nitric acid.</p> |
申请公布号 |
WO2012144161(A1) |
申请公布日期 |
2012.10.26 |
申请号 |
WO2012JP02505 |
申请日期 |
2012.04.11 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD.;KUROSAWA, YASUSHI;NETSU, SHIGEYOSHI;OKADA, TETSURO |
发明人 |
KUROSAWA, YASUSHI;NETSU, SHIGEYOSHI;OKADA, TETSURO |
分类号 |
C01B33/02 |
主分类号 |
C01B33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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