| 摘要 |
Provided are light emitting device having low cost and excellent characteristics, and a method for manufacturing the light emitting device. In the present invention, a chip-sized package having a reflecting wall is formed by forming a double structural body wherein a fluorescent material-containing film piece (2) is bonded on a light extraction surface of a semiconductor light emitting element (6) having bumps (4, 5) on an electrode-forming surface, and by covering, with a reflecting wall (3), double structural body exposed surfaces other than the bump-mounted surface (7) and the light output surface (8) of the double structural body. Consequently, a light emitting device having low cost without requiring a package substrate, and excellent luminance characteristics and heat dissipating characteristics, and a manufacturing method having excellent chromaticity yield can be provided. |
