LITHOGRAPHY SYSTEM FOR PROCESSING A TARGET, SUCH AS A WAFER, AND A METHOD FOR OPERATING A LITHOGRAPHY SYSTEM FOR PROCESSING A TARGET, SUCH AS A WAFER

摘要

The invention relates to a lithography system for processing a target, such as a wafer. The lithography system comprises a beam source arranged for providing a patterning beam, a final projection system arranged for projecting a pattern on the target surface, a chuck arranged for supporting the target and a mark position system connected to the final projection system and arranged for detecting a position mark on a surface.