发明名称 METHOD OF FABRICATING HIGH-DENSITY HERMETIC ELECTRICAL FEEDTHROUGHS
摘要 A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed.
申请公布号 WO2012145419(A2) 申请公布日期 2012.10.26
申请号 WO2012US34111 申请日期 2012.04.18
申请人 LAWRENCE LIVERMORE NATIONAL SECURITY, LLC;SHAH, KEDAR, G.;PANNU, SATINDERPALL, S.;DELIMA, TERRI, L. 发明人 SHAH, KEDAR, G.;PANNU, SATINDERPALL, S.;DELIMA, TERRI, L.
分类号 A61N1/372 主分类号 A61N1/372
代理机构 代理人
主权项
地址
您可能感兴趣的专利