STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR

摘要

A module 10 can include a module card 40 and first and second microelectronic elements 20, 30 having front surfaces 21, 31 facing a first surface 41 of the module card. The module card 40 can also have a second surface 42 and a plurality of parallel exposed edge contacts 50 adjacent an edge 43 of at least one of the first and second surfaces 41, 42 for mating with corresponding contacts 1207 of a socket 1205 when the module 10 is inserted in the socket. Each microelectronic element 20, 30 can be electrically connected to the module card 40. The front surface 31 of the second microelectronic element 30 can partially overlie a rear surface 22 of the first microelectronic element 20 and can be attached thereto.