| 摘要 |
Method for the sealed assembly of an electronic housing containing one or more electronic components, the method including: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture including a paste and nanoparticles in suspension in said paste, the size of the nanoparticles ranging from 10 to 30 nm; and closing the housing in a sealed manner by heating the housing to a temperature T of between 150� C. and 180� C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5�105 Pa. |
