| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide means for securing adhesion strength between a wiring pattern formed on a base substrate such as a resin substrate or an inorganic material substrate or the like free from unsaturated double bonds and the base substrate without performing roughening treatment for the base substrate. <P>SOLUTION: A manufacturing method of a wiring board comprises, in this oder: a step of forming an insulating film 2 on a base material 1 in a sol-gel method which uses a precursor solution adjusted within a range of pH 3 to 5; a step of forming an organic layer 3 using a silane coupling agent; a step of absorbing an ionized metal catalyst on a surface of the organic layer; a step of reducing the metal catalyst and forming an electroless plating layer using the reduced metal as a nucleus; a step of heating the electroless plating layer or the like in a nitrogen atmosphere at a prescribed temperature and for a prescribed time; a step of forming an electric plating layer 4a using an electroless plating layer 4b as a power supply layer; a step of forming a prescribed wiring pattern by patterning the electric plating layer using a photolithography method; and a step of removing an exposed electroless plating layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
