发明名称 METHOD FOR CUTTING GLASS BODY, METHOD FOR PRODUCING PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT, AND RADIO-CONTROLLED WATCH
摘要 <P>PROBLEM TO BE SOLVED: To suppress the generation of a crack to a glass body. <P>SOLUTION: A method for cutting the glass body 60 includes a groove forming process in which the glass body 60 is irradiated with laser beams along a cutting scheduled line, and a groove M' is formed on one side 50b of the glass body 60 along the cutting scheduled line, a sticking process in which after the groove forming process, an adhesive sheet 83 is stuck on the side 50b to cover at least the groove M', and a cutting process in which after the sticking process, while the glass body 60 is mounted on a supporting base part 75 through the adhesive sheet 83, a cutting blade 70 is pushed to the other surface 40b of the glass body 60 along the cutting scheduled line to apply cutting stress to cut the glass body 60 along the cutting scheduled line. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012206869(A) 申请公布日期 2012.10.25
申请号 JP20110071736 申请日期 2011.03.29
申请人 SEIKO INSTRUMENTS INC 发明人 KAWADA YASUO
分类号 C03B33/023;B23K26/00;B28D5/00;C03B33/09;H03B5/32;H03H3/02;H03H9/02 主分类号 C03B33/023
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