| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a semiconductor chip structure which has a sensor function, and in which a diaphragm is formed by using mainly MEMS technology. <P>SOLUTION: The semiconductor chip is formed in a multangular shape in a planar view, has the sensor function in the center of an effective region 17 located inside the scribe line of the outer periphery thereof, and includes electrode pads 21, 23 provided inside two apex angles in the effective region 17. In the semiconductor chip, the electrode pads 21, 23 each have a circular shape with a radius R that is R<Ls/(1+(1/sinθ)) when assuming that a virtual electrode pad having a square shape with a bondable size is formed in the position nearest to the apex angle, wherein Ls represents the distance between an apex 31 of the apex angle and the position farthest from the apex 31 in the virtual electrode pad and the angle of the apex angle is 2θ. <P>COPYRIGHT: (C)2013,JPO&INPIT |
