| 摘要 |
<P>PROBLEM TO BE SOLVED: To quickly perform heat processing to a wafer by correctly estimating the temperature of the wafer when loading the wafer. <P>SOLUTION: A heat processing control system 1 comprises: a processing container 3 which processes a wafer W held by a boat 12; a lid 10 which seals the processing container; a heater 18A which heats the processing container 3; and a control device 51 which controls the heater 18A. A profile temperature sensor holding fixture 83A is provided on the lid 10, and a profile temperature sensor 83 is provided on the profile temperature sensor holding fixture 83A. The profile temperature sensor 83 is connected to a temperature estimation part 51A. Based on a detection signal of the profile temperature sensor 83, the temperature estimation part 51A applies a primary delay filter to the detection signal of the profile temperature sensor 83 to estimate the temperature of the wafer W. The control device 51 controls the heater 18A based on the temperature of the wafer W which is obtained by the temperature estimation part 51A. <P>COPYRIGHT: (C)2013,JPO&INPIT |
