SUBSTRATE PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To quickly dry a substrate without generating destruction of a pattern formed on the surface of the substrate.

SOLUTION: When drying wafers W, first inclination means 33 controls a lifter 8 so that the wafers W are inclined in a direction vertical to the surface of the lifter 8 holding a plurality of wafers W respectively having patterns formed on respective surfaces in a vertical posture in a state that N2 is supplied from an N2 supply nozzle 28. Then, second inclination means 40 controls the lifer 8 so that the lifter 8 is inclined in a direction horizontal to the surfaces of the wafers W. Since a liquid pool 80 left in each pattern groove 72 is allowed to flow into a groove bottom 73 and discharged from a pattern side face 71, remaining liquid can be efficiently discharged.

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