| 摘要 |
A light emitting diode (LED) module package structure is described. The LED module package structure includes a metal heat dissipating board, a plurality of light emitting diode chips fixed on the metal heat dissipating board, at least one chip-scale connector fixed on the metal heat dissipating board to electrically connect to the light emitting diode chip via a bonding wire. The chip-scale connector includes a sapphire substrate, a conductive metal layer and an insulation protruding member. The insulation protruding member divides the conductive metal layer into a plurality of conductive areas. In addition, the LED module package structure can further includes a chip-scale power connector fixed in the metal heat dissipating board to connect the chip-scale connector or the light emitting diode chip via the bonding wire.
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