发明名称 |
FORMATION OF ALPHA PARTICLE SHIELDS IN CHIP PACKAGING |
摘要 |
A structure and system for forming the structure. The structure includes a semiconductor chip and an interposing shield having a top side and a bottom side. The semiconductor chip includes N chip electric pads, wherein N is a positive integer of at least 2. The N chip electric pads are electrically connected to a plurality of devices on the semiconductor chip. The electric shield includes 2N electric conductors and N shield electric pads. Each shield electrical pad is in electrical contact and direct physical contact with a corresponding pair of electric conductors of the 2N electric conductors. The interposing shield includes a shield material. The shield material includes a first semiconductor material. The semiconductor chip is bonded to the top side of the interposing shield. Each chip electric pads is in electrical contact and direct physical contact with a corresponding shield electrical pad of the N shield electric pads.
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申请公布号 |
US2012267768(A1) |
申请公布日期 |
2012.10.25 |
申请号 |
US201213533182 |
申请日期 |
2012.06.26 |
申请人 |
ANDRY PAUL STEPHEN;CABRAL, JR. CYRIL;RODBELL KENNETH P.;WISNIEFF ROBERT L.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDRY PAUL STEPHEN;CABRAL, JR. CYRIL;RODBELL KENNETH P.;WISNIEFF ROBERT L. |
分类号 |
H01L23/556;B23K3/00 |
主分类号 |
H01L23/556 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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