发明名称 |
PROCESSING METHOD AND MANUFACTURING METHOD OF WIRING BOARD, LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE LIGHT EMITTING DEVICE, AND ELECTRIC APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a first mold resin 130 from flowing out from a mounting region Rm of a wiring board 110 without using a resin dam sheet when the first mold resin 130 is injected into the mounting region Rm of the wiring board 110 so as to cover an LED chip Lc. <P>SOLUTION: A light emitting device 100 is formed by sealing an LED chip Lc in a package. In the light emitting device 100, a wiring board 110 forming the package has a protruding part 110a formed around a mounting region Rm on its surface where the LED chip Lc is disposed so as to dam the first mold resin 130 sealing the LED chip Lc. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012209417(A) |
申请公布日期 |
2012.10.25 |
申请号 |
JP20110073665 |
申请日期 |
2011.03.29 |
申请人 |
SHARP CORP |
发明人 |
KATO TATSUYA |
分类号 |
H05K3/00;H01L23/12;H01L23/28;H01L33/52;H05K1/02;H05K3/28 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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