发明名称 WIRING BOARD AND MOUNTING STRUCTURE THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board and a mounting structure thereof which meet the demand for improvement of electrical reliability. <P>SOLUTION: A wiring board 2 according to an embodiment of the present invention includes a resin layer 11 containing resin having imido group; and a metal layer 13 which is contacted with the resin layer and contains titanium. The resin layer 11 includes a first layer region 15 contacted with the metal layer 13, and a second layer region 16 located inward of the resin layer 11 compared to the first layer region 15. The first layer region 15 has a larger ratio of the number of nitrogen atoms to the number of carbon atoms than the second layer region 16. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012209494(A) 申请公布日期 2012.10.25
申请号 JP20110075363 申请日期 2011.03.30
申请人 KYOCERA CORP 发明人 YUGAWA HIDETOSHI
分类号 H05K3/38;B32B15/088;H01L23/12;H05K3/24 主分类号 H05K3/38
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