| 发明名称 |
CONDUCTIVE PARTICLE, CONDUCTIVE PASTE, AND CIRCUIT BOARD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive particle excellent in conductivity and migration resistance. <P>SOLUTION: The conductive particle includes silver particles and at least one type of sheathing selected from silver alloy covering the silver particles and silver composite. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012209148(A) |
申请公布日期 |
2012.10.25 |
| 申请号 |
JP20110074408 |
申请日期 |
2011.03.30 |
| 申请人 |
SONY CORP |
发明人 |
MOTOMURA ISATO;SUDO HAJIME;KATORI KENJI |
| 分类号 |
H01B5/00;B22F1/00;B22F1/02;C22C5/06;H01B1/00;H01B1/22;H01B5/14;H05K3/12 |
主分类号 |
H01B5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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