发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN VARNISH, PHOTOSENSITIVE RESIN FILM, AND PHOTOSENSITIVE RESIN CURED PRODUCT |
摘要 |
Provided are a photosensitive resin composition capable of being quickly cured by light and providing an optically cured product which is excellent in a transparency in a visible light of 400 to 780 nm and a heat resistant reliability, a photosensitive resin varnish, a photosensitive resin film and a photosensitive resin cured product. The photosensitive resin composition comprises (A) a polymerizable compound, (B) a polymerization initiator and (C) a hindered phenol base antioxidant, wherein (B-1) at least one selected from α-hydroxyacetophenone base photoinitiator and a glyoxy ester base photoinitiator and (B-2) a phosphine oxide base photoinitiator are contained as the component (B); the component (C) is a hindered phenol base antioxidant having in a molecule, at least one phenol group having each one group of a methyl group and a t-butyl group on the same aromatic ring; a content of the component (B) is 0.02 to 4.0 parts by mass based on 100 parts by mass of the component (A); and a content of the component (C) is 0.01 to 1 part by mass based on 100 parts by mass of the component (A). |
申请公布号 |
US2012270963(A1) |
申请公布日期 |
2012.10.25 |
申请号 |
US201013512713 |
申请日期 |
2010.11.29 |
申请人 |
SUZUMURA KOUJI;MITANI IKUE;TAKASAKI TOSHIHIKO;MUKAI IKUO;OCHIAI MASAMI |
发明人 |
SUZUMURA KOUJI;MITANI IKUE;TAKASAKI TOSHIHIKO;MUKAI IKUO;OCHIAI MASAMI |
分类号 |
C08L33/14 |
主分类号 |
C08L33/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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