FLIP-CHIP TYPE SEMICONDUCTOR REAR FACE FILM, AND DICING TAPE INTEGRATED TYPE SEMICONDUCTOR REAR FACE FILM

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device using a flip-chip type semiconductor rear face film capable of protecting a semiconductor element and facilitating adhesion and detachment of the semiconductor element.

SOLUTION: A method of manufacturing a semiconductor device using a dicing tape integrated type semiconductor rear face film having a dicing tape and a flip-chip type semiconductor rear face film, the flip-chip type semiconductor rear face film having a surface roughness (Ra) before hardening within a range from 50 nm to 3 μm on a side not opposed to a rear face of the semiconductor element when formed on the rear face of the semiconductor element, includes the following steps of: adhering a semiconductor wafer on the dicing tape integrated type semiconductor rear face film; dicing the semiconductor wafer; picking up a semiconductor element obtained by dicing; and performing flip-chip connection of the semiconductor element on an adherend.

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