| 发明名称 |
Semiconductor Device and Bonding Wire |
| 摘要 |
A semiconductor device includes a semiconductor chip, a contact pad of the semiconductor chip and a first layer arranged over the contact pad. The first layer includes niobium, tantalum or an alloy including niobium and tantalum.
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| 申请公布号 |
US2012267784(A1) |
申请公布日期 |
2012.10.25 |
| 申请号 |
US201113090092 |
申请日期 |
2011.04.19 |
| 申请人 |
HOSSEINI KHALIL;MENGEL MANFRED;MAHLER JOACHIM;INFINEON TECHNOLOGIES AG |
发明人 |
HOSSEINI KHALIL;MENGEL MANFRED;MAHLER JOACHIM |
| 分类号 |
H01L23/48;B05D1/36;B05D7/20;B32B15/02;B82Y30/00;C23C14/14;C23C14/34;C23C16/06;C25D3/54;C25D3/56 |
主分类号 |
H01L23/48 |
| 代理机构 |
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