| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can give a cured film with high resolution, having low warpage and no pattern embedment by reflow, in the process of low-temperature baking at 200°C or lower. <P>SOLUTION: The positive photosensitive resin composition contains (a) an alkali-soluble polyimide, (b) at least a compound having two or more epoxy groups in one molecule, and (c) a photoacid generator, in which the content of at least the (b) compound having two or more epoxy groups in one molecule is 10 to 50 parts by weight with respect to 100 parts by weight of the (a) alkali-soluble polyimide. <P>COPYRIGHT: (C)2013,JPO&INPIT |
