| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus which suppresses vibrations of a semiconductor lamination unit to a frame located in a direction that intersects the lamination direction of the semiconductor lamination unit without inhibiting the transmission of a pressing force applied to the semiconductor lamination unit by a pressurizing member. <P>SOLUTION: An electric power conversion apparatus 1 includes: a semiconductor lamination unit 10 formed by semiconductor modules 11 and cooling tubes 120; and a pressurizing member 4 pressurizing the semiconductor lamination unit 10 in the lamination direction X. Further, the electric power conversion apparatus 1 has: a contact plate 3 disposed between the pressurizing member 4 and the semiconductor lamination unit 10; and a frame 21 in which the semiconductor lamination unit 10, the pressurizing member 4, and the contact plate 3 are disposed on the inner side thereof. The semiconductor lamination unit 10 has vibration regulating means 34 regulating vibrations in a direction that intersects the lamination direction X while allowing the movements of the contact plate 3 in the lamination direction X. <P>COPYRIGHT: (C)2013,JPO&INPIT |
