发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, FERROELECTRIC ELEMENT MANUFACTURING METHOD AND ELECTRONIC APPARATUS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide manufacturing methods of a semiconductor device and a ferroelectric element capable of controlling orientation and easy to be employed in a liquid process. <P>SOLUTION: A semiconductor device manufacturing method according to the present invention is the manufacturing method of a semiconductor device including a source electrode and a drain electrode, an organic semiconductor film arranged between the source electrode and the drain electrode and having a channel part, a gate electrode, and a gate insulation film arranged between the channel part and the gate electrode, the method comprising: a step of heating the channel part to a first temperature; and a step of forming the gate insulating film by a coating process in which a liquid droplet material including insulative polymer of a second temperature lower than the first temperature is arranged on the organic semiconductor film of the first temperature and extended in a constant direction. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012209410(A) 申请公布日期 2012.10.25
申请号 JP20110073585 申请日期 2011.03.29
申请人 SEIKO EPSON CORP 发明人 YASUDA TAKURO
分类号 H01L27/105;H01L21/312;H01L21/336;H01L21/8246;H01L27/28;H01L29/786;H01L29/788;H01L29/792;H01L51/05;H01L51/30;H01L51/40 主分类号 H01L27/105
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