| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging module which can be formed with a simple process while mechanical strength on bending an inner lead and for fixing the inner lead is kept without enlarging an external dimension of the imaging module. <P>SOLUTION: The imaging module includes: an imaging element having an imaging face; a flexible substrate arranged to face the back of the imaging face; and first and second guide members fixing the imaging element and the flexible substrate. The first guide member includes a first guide face extending along a face opposite to the imaging face of the imaging element and a second guide face extending along the flexible substrate. The second guide member includes a first guide part extending along a face opposite to the first guide face in the first guide member and a second guide part extending between the second guide face and the flexible substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
