| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board in which a build-up wiring layer is formed on a temporary substrate in a peelable state such that the wiring board can be manufactured with good reliability at low cost without any trouble. <P>SOLUTION: A ground layer is arranged in a wiring formation region A on a prepreg, a metal foil is arranged on the prepreg with the ground layer interposed so that the metal foil larger than the ground layer comes into contact with an outer peripheral part B of the wiring formation region A, and the prepreg is cured by heating and pressurization to bond the metal foil to a temporary substrate while obtaining the temporary substrate. At this time, the ground layer and the metal foil have an adhesion strength of 0.01 N/cm to 0.04 N/cm. A wiring member having the build-up wiring layer formed on the metal foil is obtained thereafter by forming the build-up wiring layer on the metal foil, and separating the metal foil from the temporary substrate by cutting a peripheral edge part of the ground layer of the structure. Then the metal foil is removed to obtain a wiring layer having no core base material. <P>COPYRIGHT: (C)2013,JPO&INPIT |
