| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting structure body of an electronic component provided with a structure that hardly causes a problem in a connecting portion. <P>SOLUTION: A mounting structure body 10 of an electronic component 4 is configured by electrically connecting the electronic component 4 provided with bump electrodes 23 that have a structure in which a plurality of portions extending along a longitudinal direction of a surface of resin as a core is covered with conductive films made of metal and a substrate 11 provided with metal terminals 12 to each other. At positions in which the bump electrodes 23 are connected to the metal terminals 12, groove portions that divide each of contact regions between the bump electrodes 23 and the metal terminals 12 into at least two regions are formed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
