| 摘要 |
<p>PURPOSE: An adhesive composition and a connection structure for a circuit member using the adhesive composition are provided to obtain excellent adhesive strength in a curing condition of short time and low temperature. CONSTITUTION: An adhesive composition includes a thermoplastic resin, a radical polymeric compound, a dendritic compound which is connected to a core part in order to dendritic-branch a branched part and has a terminal part at the end of the branched part, and a radical polymerization initiator. The average molecular weight of the dendritic compound is 1000 or more and less than 10000.</p> |
