| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition not necessitating degassing in molding, and excellent in moldability and tracking resistance. <P>SOLUTION: The thermosetting resin composition contains (A) a bis(2-oxazoline) compound and (B) a phenol resin, wherein when the thermosetting resin composition is heated at 150°C, the difference (W<SB POS="POST">0</SB>-W<SB POS="POST">1</SB>) between a weight (W<SB POS="POST">0</SB>) thereof before heated and a weight (W<SB POS="POST">1</SB>) thereof after heated is ≤5 wt.% to the weight (W<SB POS="POST">0</SB>) thereof before heated. <P>COPYRIGHT: (C)2013,JPO&INPIT |
