| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a circuit area of each semiconductor chip of a semiconductor wafer in which trimming that utilizes a fuse memory is performed. <P>SOLUTION: A silicon substrate of a semiconductor wafer 10 is partitioned into a plurality of chip regions TAR and scribe regions SAR which surrounds the region TAR. In the chip region TAR, there are formed a trimmed circuit 11, a fuse element Fm(m=1 to 2M), and a constant current source IPm(m=1 to 2M) and an invertor INm(m=1 to 2M) which play a role of a detection circuit for detecting whether or not the fuse element Fm(m=1 to 2M) is disconnected. In the scribe region SAR, there is an N channel field effect transistor TSm(m=1 to 2M) which is switched between ON/OFF according to a control signal, and generates a current for disconnecting the fuse element Fm(m=1 to 2M) when switched to be ON. <P>COPYRIGHT: (C)2013,JPO&INPIT |
