发明名称 |
SCREEN PRINTING DEVICE, ADSORPTION PLATE THEREOF, AND METHOD FOR PRODUCTION OF FLEXIBLE PRINTED WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To prevent deformation of a wiring board due to protrusion occurred in the previously printed solder resist to eliminate partial thickness unevenness of the solder resist to be printed afterward. <P>SOLUTION: There is provided a screen printing device which prints a solder resist covering the prescribed portion of a wiring pattern on one surface of a flexible printed wiring board and then, prints the solder resist on the other surface. The device includes an adsorption plate for fixing the wiring board by adsorbing one surface thereof in vacuum, and a squeegee for printing the solder resist afterward by moving to the other surface via a screen mask. The adsorption plate comprises an adsorption hole for fixing the wiring board, and a recess for flatly holding the wiring board by absorbing the protrusion generating on the solder resist toward one surface of the previously printed board when fixing the board by adsorbing one surface thereof in vacuum. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012206400(A) |
申请公布日期 |
2012.10.25 |
申请号 |
JP20110074146 |
申请日期 |
2011.03.30 |
申请人 |
HITACHI CABLE LTD |
发明人 |
FUKUI KAZUKI;TAKAHASHI TAKESHI;MORITA MASAMIKI |
分类号 |
B41F15/26;B41F15/08;B41F15/20;H01L21/60;H05K3/28 |
主分类号 |
B41F15/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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