SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MODULE, AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To secure adhesiveness between a semiconductor element and a sealing resin sealing the semiconductor element and a heat sink and reduce the reverse warpage of the semiconductor device sealed by the sealing resin in the semiconductor device where the semiconductor element is mounted on the heat sink.

SOLUTION: A semiconductor element 1 is mounted on one surface of a heat sink 3 made of copper or a metal composed mainly of copper. The semiconductor element 1 is resin-sealed by a sealing resin 8, and the sealing resin 8 includes a first sealing resin 8a and a second sealing resin 8b having a larger heat expansion coefficient than the first sealing resin 8a. The first sealing resin 8a is formed so as to cover the semiconductor element 1, and the second sealing resin 8b is formed at the outer side of the first sealing resin 8a.

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