| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-treated copper foil excellent in circuit forming properties of a fine pattern, transmitting properties in a high-frequency range, adhesiveness to a resin base, and chemical resistance. <P>SOLUTION: The surface-treated copper foil has layers formed as follows: a first treatment layer of Ni or Ni-P with a deposition amount of 0.05-1.0 mg/dm<SP POS="POST">2</SP>is formed on the surface of at least one side of a base copper foil having a surface roughness Ra of ≤0.2 μm or a surface roughness Rz of ≤1.5 μm; a second treatment layer of Zn or Zn-V with a deposition amount of 0.01-0.10 mg/dm<SP POS="POST">2</SP>is formed on the first treatment layer; a chromate treatment layer with a contact angle θ (hydrophilicity) of 15°-35° is formed on the second treatment layer; a silane coupling treatment layer with a deposition amount of 0.002-0.02 mg/dm<SP POS="POST">2</SP>is formed on the chromate treatment layer. A method for manufacturing a copper-clad laminated board formed by laminating the surface-treated copper foil and a thermosetting resin board is executed as follows: the surface-treated copper foil and the thermosetting resin board are thermally laminated under the condition that an LMP value shown in a formula 1 is ≤10,660; and a functional group in the outermost silane coupling treatment layer is reacted with a functional group in the thermosetting resin, wherein a formula 1 is LMP=(T+273)*(20+log t), and 20 is a material constant of the copper, T is a temperature(°C), t is a time(hr), and log is a common logarithm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
