| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive lead component which is easily connected with a semiconductor chip and has excellent connectivity. <P>SOLUTION: A lead component includes a base material having a connection part connecting with a semiconductor chip. The lead component has a solder material, formed by sequentially laminating a Zn joining material and an Al joining material from the base material side and rolling and clad-joining these joining materials, at a predetermined area including the connection part on the base material. Further, a surface of the Al joining material is covered by a metal thin film formed by one kind or two or more kinds of metals selected from Au, Ag, Cu, Ni, Pd, and Pt. <P>COPYRIGHT: (C)2013,JPO&INPIT |
