| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique, by which a depth of a recess formed on a substrate can be checked without breakage or contact at a high speed. <P>SOLUTION: A substrate checking device 100 comprises a radiation part 12 for radiating terahertz waves toward a substrate W according to radiation of pump light; a detection part 13 for detecting electric field strength of the terahertz waves permeating through the substrate W according to radiation of probe light; and a delay part 14 for delaying a time, at which the terahertz waves reach the detection part 13 and a detection timing at the detection part 13. Also, the substrate detection device 100 comprises a time waveform construction part 21 for constructing a time waveform of first terahertz waves permeating through a first region of the substrate W; and a phase difference acquisition part 24 for acquiring a phase difference between the first terahertz waves and the second terahertz waves by comparing the electric field strength detected at a specific detection timing with the time waveform of the second terahertz waves permeating through a second region of the substrate W. <P>COPYRIGHT: (C)2013,JPO&INPIT |
