发明名称 MANUFACTURING METHOD FOR MICROCHANNEL CHIP MADE OF RESIN AND MICROCHANNEL CHIP
摘要 <P>PROBLEM TO BE SOLVED: To prevent the collapse of a microchannel or the breakage of a protrusion in a thermocompression bonding method for a substrate provided with a microchannel on one face and a plane substrate, or for a substrate having a protrusion on one face, which are made of resin materials. <P>SOLUTION: In a thermocompression bonding method, a tool for thermocompression having a concave part or a through-hole in the position corresponding to the protrusion on one face side of the substrate is used. A face having a channel of the first substrate which has a microchannel provided in one face, and a face on the other side of the second substrate which has a protrusion on one face are laminate in such a manner that they contact, and the face of the side other than the contacting face is pressed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012206098(A) 申请公布日期 2012.10.25
申请号 JP20110075974 申请日期 2011.03.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 YOSHIKUNI TAKURO;ARAI SUSUMU
分类号 B01J19/00;B29C65/20;G01N35/08;G01N37/00 主分类号 B01J19/00
代理机构 代理人
主权项
地址