COPPER FINE PARTICLE DISPERSION LIQUID, AND METHOD FOR PRODUCING COPPER FINE PARTICLE SINTERED COMPACT

摘要

PROBLEM TO BE SOLVED: To provide a copper fine particle dispersion liquid which can obtain a sintered compact having excellent conductivity and the strength of a sintered film even if the lower limit temperature of sintering is an extremely low temperature of 65°C.

SOLUTION: The copper fine particle dispersion liquid includes: copper fine particles (P); platinum group metal catalyst fine particles (C); and an organic dispersion medium (S). The organic dispersion medium (S) includes polyol (S1), the average primary particle diameters (R1) of the copper fine particles (P) and the platinum group metal catalyst fine particles (C) are 1 to 100 nm and 50 nm to 100 μm, respectively. The ratio of the platinum group metal catalyst fine particles (C) to the total content of the copper fine particles (P) and the platinum group metal catalyst fine particles (C) is 0.1 to 20 mass%. The ratio between the number of the moles (MOH) of a hydroxy group and the number of the moles (MP) of the copper fine particles (P), [(MOH)/(MP)] is ≥10.

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