| 摘要 |
The stacked-substrate structure includes a first substrate having a first die embedded therein, a second substrate having a second die embedded therein, a plurality of soldering elements, and a third die. The soldering elements are disposed between the first and the second substrates and connected to the first and the second substrates. The first and the second substrates are electrically connected via the soldering elements. The first substrate, the second substrate, and the soldering elements define an accommodating space. The third die is arranged in the accommodating space and is connected to one surface of the first substrate. The third die is electrically connected to the first and the second dies via the first substrate. Thus, the thickness of the stacked-substrate structure can be reduced, and the first and the second dies of the stacked-substrate structure can be test separately in different platforms.
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