发明名称 |
ELECTRONIC COMPONENT PACKAGE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component package which maintains airtightness in a package. <P>SOLUTION: A piezoelectric vibrator 1 of this invention is an electronic component package which encloses an electronic component 4 in a cavity 30 formed between multiple substrates which are joined to each other. In the piezoelectric vibrator 1, an inter-substrate wiring electrode 5 is hermetically formed in the base substrate 2 for creating electrical continuity between a bottom surface (external electrode 6) of the base substrate 2 and an upper surface (internal electrode 9) of the base substrate 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012209691(A) |
申请公布日期 |
2012.10.25 |
申请号 |
JP20110072734 |
申请日期 |
2011.03.29 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
HAMAO HISANORI;SARADA TAKASHI;MITSUSUE RYUTA;TAKAHASHI HIROSHI |
分类号 |
H03H9/02;H01L23/04;H01L23/08 |
主分类号 |
H03H9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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