| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a retainer for a semiconductor chip capable of improving productivity, preventing deterioration of a product rate, and also reducing manufacturing costs, and its usage. <P>SOLUTION: In this retainer, an adhesive holding layer 10 is laminated on a supporting substrate 1, and plural semiconductor chips 2 jointed to a semiconductor wafer in line with each other are detachably and adhesively held. The supporting substrate 1 is formed into an approximately same size as that of the semiconductor wafer, and plural working holes 3 for the semiconductor chips 2 are bored on the supporting substrate 1. The adhesive holding layer 10 is provided with flexibility. One part of the adhesive holding layer 10 serves as an adhesion region 11 to the supporting substrate 1, and the remaining part of the adhesive holding layer 10 serves as a non-adhesion region 13 not adhered to the supporting substrate 1. Plural holding parts 15 for the semiconductor chips 2 are aligned and formed on the non-adhesion region 13, and each holding part 15 is blocked to be larger than the semiconductor chip 2. Each holding part 15 is opposed to the working holes 3 of the supporting substrate 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
