| 摘要 |
Wafer-level reflow apparatuses and fabrication methods for solder balls and flip chip assemblies are presented. The wafer-level reflow apparatus includes pluralities of heating zones and a conveyer belt transporting a wafer to each heating zone. Each heating zone includes a heating chuck in configured with several concentric heaters, an IR temperature detector, and a controller controlling heating output of each heater respectively, wherein the IR temperature detector monitors temperatures of multiple regions of the surface of the wafer, thereby feeding back the temperatures to the controller to unify temperature of the solder bump on the wafer. |
