PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to form a thermal via which is bigger than a signal via in a region which radiating is required, thereby increasing thermal effect. CONSTITUTION: A base substrate(100) includes a first via hole and a second via hole. Circuit layers(107,113) including connection pads(107a,107b,107c,107d) are formed in both sides of the base substrate. A first via(105) is composed of a conductive metal which is formed in an inside of the first via hole. A second via(103) is composed of the conductive metal which is formed in the inside of the second via hole. A diameter of the second via is bigger than the diameter of the first via.