| 发明名称 |
Substrate for element-mounted device |
| 摘要 |
<p>A substrate, which has a high thermal conductivity material layer having a thermal conductivity of at least 10 W/cm•K and which has a cooling medium flow path on or in the high thermal conductivity material layer, has a high heat-dissipating property. <IMAGE></p> |
| 申请公布号 |
EP1154476(B1) |
申请公布日期 |
2012.10.24 |
| 申请号 |
EP20010113660 |
申请日期 |
1995.11.30 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LIMITED |
发明人 |
YAMAMOTO, YOSHIYUKI;TANABE, KEIICHIRO;HARANO, KATSUKO;OTA, NOBUHIRO;FUJIMORI, NAOJI |
| 分类号 |
H01L23/373;G21K1/10;H01J35/18;H01L23/473;H01S5/02;H01S5/024;H05H7/00 |
主分类号 |
H01L23/373 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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