发明名称 |
High frequency multi-layered circuit component |
摘要 |
<p>A high frequency multi-layered circuit component (11), comprising a plurality of layers (12-14) laminated to each other; an active element mounted on one of the plurality of layers; at least one passive element formed within the plurality of layers (12-14); a high frequency circuit constituted by at least part of the at least one passive element; a power supply line (15) for supplying direct-current power to the active element disposed along one of the plurality of layers (12-14); high frequency hot-lines included in the high frequency multi-layer circuit component (11) and disposed along one or more of the plurality of layers (12-14) which are different from the one of the plurality of layers (12-14) along which the power supply line (15) is disposed; and a ground layer (16, 17) forming capacitance with the power supply line (15) and disposed between the power supply line (15) and the high frequency hot-lines. <IMAGE></p> |
申请公布号 |
EP1061577(B1) |
申请公布日期 |
2012.10.24 |
申请号 |
EP20000112296 |
申请日期 |
2000.06.08 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
SHIMADA, NORIHIRO;ISHII, TAKEHITO;YOSHIMOTO, YOSHIHIRO;TONEGAWA, KEN |
分类号 |
H01L21/822;H01L23/538;H01L23/12;H01L23/13;H01L23/498;H01L23/50;H01L23/552;H01L23/64;H01L23/66;H01L27/04;H03F3/60;H03H7/01;H04B1/40;H05K1/00;H05K1/02;H05K1/16;H05K9/00 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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