发明名称 METHOD OF MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PURPOSE: A manufacturing method of a flexible printed circuit board is provided to easily arrange elements of the flexible printed circuit board such as a chip, a via hole and a conductive layer installed on a substrate. CONSTITUTION: A substrate(100) is composed of a conductive layer(120) and an insulating layer(110). A circuit pattern(130) is formed on the conductive layer. Conductive paste(140) is printed on the substrate. Components(150) are mounted on the conductive paste. The conductive paste is built. A prepreg layer(160) is formed on the components and the circuit pattern. A copper foil layer(170) is laminated on the prepreg layer.
申请公布号 KR20120117438(A) 申请公布日期 2012.10.24
申请号 KR20110035195 申请日期 2011.04.15
申请人 INTERFLEX CO., LTD. 发明人 YANG, HO MIN
分类号 H05K3/46;H05K1/18 主分类号 H05K3/46
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