| 发明名称 |
Process of fabricating a slip ring component |
| 摘要 |
<p>A process of fabricating a slip ring component (106), and a slip ring assembly (100) are disclosed. The process includes forming a first shot, forming a second shot, and immersion bathing the first shot and the second shot. The immersion bathing applies an electrically conductive plating to exposed surfaces of the second shot.</p> |
| 申请公布号 |
EP2515392(A2) |
申请公布日期 |
2012.10.24 |
| 申请号 |
EP20120163401 |
申请日期 |
2012.04.05 |
| 申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
LENKER, WILLIAM GARY;GRIFFITH, GREGORY GORDON;HOWARD, EDWARD JOHN |
| 分类号 |
H01R43/10;H01R39/08;H01R39/14;H01R107/00 |
主分类号 |
H01R43/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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